Job Description

Job Description

Company Overview:

“Always the Best, Always Fun!”

DISCO Corporation is a global powerhouse in precision cutting, grinding, and polishing solutions, with a reputation for excellence across the semiconductor, medical devices, and electronic component industries. Headquartered in Tokyo, Japan, we are a forward-thinking company with a strong presence in 60+ locations worldwide with a diverse team of 7,000+ employees. Our success is driven by our core DISCO values that emphasize trust, continuous innovation, and an unwavering commitment to quality. At DISCO, we pride ourselves on fostering an inclusive culture where employees thrive, grow, and contribute to shaping the future of technology.

DISCO Corporation’s U.S affiliate, DISCO Hi-Tec America, Inc. (DHA), is looking to expand our Technical Services team! We are currently people who bring fresh perspectives, new ideas, and unique skills to join us as an Equipment Operator in our San Jose, CA office.

This is a full-time position with benefits including Bonuses, Insurance (Medical, Dental, Vision, Life), Health Savings Account, 401(k), Paid Time Off, Paid Holidays.

Key Responsibilities:

• Be the direct line of contact for a dedicated set of customers and see through full process of customer requests - including scheduling wafer shipments and processing schedules, operating semiconductor equipment to process customer wafers, and more.
• Ability to handle fragile materials and follow standard operating procedures with no supervision.
• Handle quality control inspection of customer wafers and processes.
• Perform first check and initial root cause analysis of any errors during wafer processing, handling any documentation and reporting as needed.
• Occasionally assist the shipping and receiving team in packaging of customer products.
• Apply strong attention to detail and teamwork skills with the ability to communicate effectively, identify improvements, and follow procedures.
• Participate in DISCO corporate activities focusing on continuous improvement, deeper thinking, and value exchange.
• Able to work in a fast paced environment while meeting required deadline
• Perform other duties as assigned.

Preferred Experience and Qualifications:

• High School diploma or equivalent required; technical training in a related field preferred.
• Ability to identify potential process improvement initiatives
• Previous manufacturing, fabrication, or machine experience handling wafers in a cleanroom setting is a plus
• Understanding of Hazmat/Hazwoper protocols is also a plus
• High levels of professionalism and customer interfacing skills.
• Creative and flexible self-starter with strong attention to detail.
• Knowledge in MS office (Powerpoint, Excel, and Word) and email systems.

Physical Requirements:

• Job duties are mostly performed in cleanroom environment, sometimes in awkward positions.
• Role involves a combination of remaining in a stationary position and moving about for extended periods.
• May require bending, stooping, and working in varied physical positions to access hard to reach areas on equipment.
• Lift and carry or otherwise move at least 30lbs.
• Wear personal protective gear for extended periods and use proper safety procedure when working with delicate materials, hazardous chemicals, moving mechanical parts, etc.

Interpersonal Skills:

• Clear, concise, and effective communication skills to interact with colleagues, customers, and leadership.
• A high degree of self-motivation and creativity, with the ability to perform under pressure, even in challenging situations.
• A natural ability to build strong relationships, maintaining trust and teamwork within a global company, building upon DISCO’s culture to help build an inclusive work environment.
• Willingness to lead peers on projects and act as a resource for colleagues.

"We are not accepting unsolicited resumes from recruitment agencies."

DISCO Hi-Tec America, Inc. is committed to Equal Employment Opportunity and diversity in its workforce without discrimination

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